Multi-part electrode for a semiconductor processing plasma reactor and method of replacing a portion of a multi-part electrode

ABSTRACT

An improved upper electrode system has a multi-part electrode in which a central portion of the electrode having high wear is replaceable independent of an outer peripheral portion of the electrode. The upper electrode can be used in plasma processing systems for processing semiconductor substrates, such as by etching or CVD. The multi-part upper electrode system is particularly useful for large size wafer processing chambers, such as 300 mm wafer processing chambers for which monolithic electrodes are unavailable or costly.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to U.S. Provisional Patent ApplicationSer. No. 60/383,164 filed May 23, 2002, which is incorporated herein byreference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a multi-part upper electrode for asemiconductor processing plasma reactor and a method of replacing aneroded portion of the multi-part upper electrode.

2. Description of the Related Art

Electrodes used in plasma processing reactors for processingsemiconductor substrates such as silicon wafers are disclosed in U.S.Pat. Nos. 5,074,456 and 5,569,356, the disclosures of which are herebyincorporated by reference.

Dry plasma etching, reactive ion etching, and ion milling techniqueswere developed in order to overcome numerous limitations associated withchemical etching of semiconductor wafers. Plasma etching, in particular,allows the vertical etch rate to be made much greater than thehorizontal etch rate so that the resulting aspect ratio (i.e., theheight to width ratio of the resulting notch) of the etched features canbe adequately controlled. In fact, plasma etching enables very finefeatures with high aspect ratios to be formed in films over 1 micrometerin thickness.

During the plasma etching process, a plasma is formed above the maskedsurface of the wafer by adding large amounts of energy to a gas atrelatively low pressure, resulting in ionizing the gas. By adjusting theelectrical potential of the substrate to be etched, charged species inthe plasma can be directed to impinge substantially normally upon thewafer, wherein materials in the unmasked regions of the wafer areremoved.

The etching process can often be made more effective by using gases thatare chemically reactive with the material being etched. So called“reactive ion etching” combines the energetic etching effects of theplasma with the chemical etching effect of the gas. However, manychemically active agents have been found to cause excessive electrodewear.

It is desirable to evenly distribute the plasma over the surface of thewafer in order to obtain uniform etching rates over the entire surfaceof the wafer. For example, U.S. Pat. Nos. 4,595,484, 4,792,378,4,820,371, 4,960,468 disclose showerhead electrodes for distributing gasthrough a number of holes in the electrodes. These patents generallydescribe gas distribution plates having an arrangement of aperturestailored to provide a uniform flow of gas vapors to a semiconductorwafer.

A reactive ion etching system typically consists of an etching chamberwith an upper electrode or grounded electrode and a lower electrode orRF electrode positioned therein. The wafer to be etched is covered by asuitable mask and placed directly on the RF electrode. The wafer isnegatively biased as a result of its interaction with the plasma. Achemically reactive gas such as CF₄, CHF₃, CClF₃, and SF₆ or mixturesthereof with O, N₂, He, or Ar is introduced into the etching chamber andmaintained at a pressure which is typically in the millitorr range. Thegrounded electrode is provided with gas holes which permit the gas to beuniformly dispersed through the electrode into the chamber. The electricfield established between the grounded electrode and the RF electrodewill dissociate the reactive gas forming a plasma. The surface of thewafer is etched by chemical interaction with the active ions and bymomentum transfer of the ions striking the surface of the wafer. Theelectric field created by the electrodes will attract the ions to thewafer, causing the ions to strike the surface in a predominantlyvertical direction so that the process produces well-defined verticallyetched side walls.

The exposed surfaces of the upper electrode are also etched during waferprocessing. Electrode loss or etching results in a need to periodicallyreplace the upper electrode. Thus, it would be desirable to makeelectrode replacement simple and economical.

As substrate size increases it is important to ensure uniform etchingand deposition with increasingly large wafer sizes and correspondinglylarge electrode sizes. The industry move from 200 mm to 300 mm wafersallows manufacturers to double their wafer area and chip output. Theincrease in wafer size results in certain difficulties in scaling up ofthe wafer processing tools. For example, single crystal silicon boulesused to make some upper electrodes are manufactured in sizes up to 15inches, in diameter. The larger diameter single crystal siliconelectrodes are difficult to manufacture with the desired low impuritylevels. Thus, the large diameter single crystal silicon electrodes arecostly.

An upper showerhead electrode 10 and a smaller lower electrode 12 for asingle wafer etch chamber are shown in FIG. 1. The configuration of FIG.1 shows an electrode configuration for a capacitively coupled, confinedplasma etch chamber with one electrode powered by two RF sources atdifferent frequencies and the other electrode grounded. The lowerelectrode 12 is a flat electrode on which a wafer W is supported. Thelower electrode 12 is spaced 1 to 2 cm below the upper electrode 10. Inthis configuration, the upper electrode 10 has a step 14 ground into theelectrode providing an electrode with a thinner inner portion, an angledstep portion, and a thicker outer perimeter. The step 14 has beendesigned to provide etch rate uniformity at the edge of the chip.

The electrode 10 has a diameter of 15″ to accommodate 300 mm wafers. Anextension 16 of the electrode 10 is provided which extends the electrodefrom 15″ to 17″ and is constructed of a plurality of silicon segments.This configuration requires a single crystal silicon electrode 10 havinga diameter of 15″ which is then ground to form the step 14. This largediameter electrode 10 is quite costly and requires periodic replacementdue to wear.

SUMMARY OF THE INVENTION

The present invention relates to a multi-part upper electrode for asemiconductor processing reactor with a replaceable portion and a methodof replacing a portion of the electrode.

In one embodiment, a multi-part electrode for a plasma reaction chamberincludes an electrode top plate and an electrode connected to the topplate. The electrode includes a central silicon element and a pluralityof silicon segments surrounding the central silicon element. The centralsilicon element is removable from the top plate independent of thesilicon segments.

In another embodiment, a plasma processing system includes a plasmaprocessing chamber, a substrate support within the plasma processingchamber, an RF energy source, a lower electrode, and an upper electrode.The upper electrode includes an electrode top plate, central electrodeelement secured to the top plate, and a plurality of electrode segmentssecured to the top plate surrounding the central electrode element. Theelectrode segments can be formed of the same material as the centralelectrode element and a joint between the electrode segments and thecentral electrode is positioned where erosion of the electrode dropsfrom high wear to low wear.

In another embodiment, a multi-part electrode for a plasma reactionchamber includes an electrode top plate and an electrode connected tothe top plate. The electrode includes a central electrode element havinga diameter of about 13 inches or less and a plurality of electrodesegments surrounding the central electrode element to create a totalelectrode diameter of at least 16 inches. The central electrode elementis removable from the top plate independent of the electrode segments.

In a further embodiment, a method of replacing a portion of an electrodein a plasma reaction chamber, includes the steps of providing an upperelectrode in a plasma processing chamber, removing the central electrodefrom the top plate when it becomes eroded, and replacing the centralelectrode with a new central electrode. The upper electrode comprising acentral electrode element and a plurality of electrode segmentssurrounding the central electrode element. The central electrode and theelectrode segments are independently secured to a top plate of theelectrode.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

The invention will now be described in greater detail with reference tothe preferred embodiments illustrated in the accompanying drawings, inwhich like elements bear like reference numerals, and wherein:

FIG. 1 is a side cross sectional view of a portion of upper and lowerelectrodes in a prior art wafer processing chamber.

FIG. 2 is a side cross sectional view of a portion of a wafer processingchamber having a multi-part electrode with a replaceable centralelectrode element.

FIG. 3 is a graph of the silicon loss across a flat electrode.

DETAILED DESCRIPTION OF THE INVENTION

The present invention provides an improved upper electrode system with amulti-part electrode in which a central portion of the electrode havinghigh wear is replaceable independent of an outer peripheral portion ofthe electrode. The upper electrode can be used in plasma processingsystems for processing semiconductor substrates, such as by etching orCVD. The multi-part upper electrode system is particularly useful forlarge size wafer processing chambers, such as 300 mm wafer processingchambers for which monolithic electrodes are unavailable or costly.

FIG. 2 illustrates a portion of a plasma processing system 100 having animproved upper electrode system allowing replacement of a portion of theupper electrode. As shown in FIG. 2, a central electrode element 110 ismounted on a backing plate 112 by a thermally and electricallyconductive elastomer. A plurality of segmented electrodes 114 form aring around the central electrode 110 and are also mounted to a backingplate 116. The electrode backing plates 112, 116 are secured to a topplate 118 in a removable manner. A processed gas is delivered through achannel 122 in the top plate 118 to a plurality of channels 124 abovethe backing plate 112. The process gas is delivered to the waferprocessing chamber through a plurality of perforations 128 in theelectrode 110 and backing plate 112 which are in the form of ashowerhead electrode.

A sealing ring 120 is provided between the top plate 118, and thebacking plates 112, 116 to prevent gas flow from the channels 124 intothe annulus between the central electrode 110 and the electrode segments114. The sealing ring 120 is provided with O-rings 130 in annularchannels in the sealing ring to provide a gas tight seal.

A step 140 is provided in the electrode segments 114 which has beendesigned to provide etch rate uniformity at the edge of the wafer W. Thestep 140 is substantially aligned above an edge of a bottom electrode150 and is positioned just outside the edge of the wafer W.

The electrode segments 114 may include any number of segments forexample, 3 to 10 segments can be used.

The electrodes 110, 114 are secured to the top plate 118 by threadedscrews 134, 136 extending from the back side of the top plate and intothe backing plates 112, 116. The threaded screws 134, 136 allow theindependent removal of the central electrode 110 and the electrodesegments 114 when required. Since the wear of the central electrode 110is estimated to be two to three times the rate of wear on the electrodesegments 114 the central electrode can be removed and replaced moreoften than the outer electrode segments.

FIG. 3 illustrates the etch rate or silicon loss of a silicon upperelectrode having a flat shape at different diameters of the electrode.As can be seen in FIG. 3, the loss or rate of etching of the siliconelectrode decreases significantly at a radius of between 5″ and 6.5″from the center of the electrode. Accordingly, it can be seen that aportion of the electrode outside of about 6.5″ in diameter can bereplaced less frequently than the central portion of the electrode.

Examples of materials which may be used for the central electrode 110and the surrounding electrode segments 114 include SiC, SiN, AlN, andAl₂0₃. One particularly preferred material for the electrodes 110 and114 has been found to be silicon since it introduces no additionalunwanted elements into the reaction and erodes smoothly creating veryfew particles. Either single crystal silicon or poly crystalline siliconmay be used.

The backing plates 112 and 116 to which the electrodes 110 and 114 aresecured, should be chemically compatible with the process gas, match thecoefficient of thermal expansion of the electrodes, be electrically andthermally conductive, and have sufficient mechanical strength to allowfastening to the conductive top plate 118. Examples of materials whichcan be suitable for use as the top plates include graphite and SiC.

The top plate 118 should be formed of a material which is chemicallycompatible with the process gas, is electrically and thermallyconductive, and has sufficient mechanical strength to support thebacking plates and the electrodes. One example of the material for thetop plate is aluminum.

The sealing ring 120 can be formed from aluminum SiC, silicon, graphite,or quartz, or other materials which are acceptable for use in a plasmaprocessing system.

In addition to the bonding of the electrodes 110 and 114 to thecorresponding backing plates 112 and 116 with a thermally andelectrically conducted elastomer, a support member such as an aluminummesh can be provided between the electrodes and the backing plates toassure stable electrical and thermal contact over the lifetime of theelectrode.

The electrode segments 114 may each be fixed to an independent segmentof backing plate 116 or all of the electrode segments 114 can be bondedonto a single backing ring allowing the electrode segments 114 to beremoved together in a single step.

Example

One example of a configuration for the plasma processing system 100 ofFIG. 2 includes a central electrode element 110 cut from a 12″ singlecrystal silicon boule. The central electrode element 110 has a thicknessof about 0.25″ and an entirely planar lower surface. This diameter ismuch less expensive to manufacture than a 15″ single crystal siliconelectrode due to the large commercial production of 12″ single crystalsilicon boules for production of 300 mm wafers. The outer segmentedportion of the electrode is fabricated from single crystal siliconsegments which can be cut from 12″ diameter single crystal silicon andbonded to a ring-shaped graphite backing plate 116. In this example, sixelectrode segments are bonded to a ring-shaped graphite backing plate116 with the electrode segments 114 having a thickness of about 0.5″ andan angled step 140 ground at an angle of about 45 from the thickness of0.5″ down to a thickness of 0.25″ at the inner diameter of the segments.The electrode segments 114 together form a ring having an inner diameterof about 12″ and an outer diameter of about 17″. The sealing ring 120 isa quartz ring with elastomeric O-rings and the top plate 118 is formedof Aluminum.

In the 300 mm wafer processing system described in the above example(with a flat electrode), it has been shown that erosion of the siliconupper electrode drops sharply at a radius of about 5″ to about 6.5″ (seeFIG. 3). Accordingly, the joint between the central electrode 110 andthe electrode segments 114 is positioned at about 5″ to about 6½″ from acenter of the electrode, preferably at a radius of about 6″. Putting thebreak between the inner and outer parts of the electrode at about 6″will allow replacement of the more highly wearing central electrodeelement 110 independent of the electrode segments 114. The outerelectrode segments 114 should experience 2-3 times the life of thecentral electrode 110 reducing costs of electrode replacement. Theplacement of the joint radially inward of the step 140 also allows theuse of a central electrode 110 having a smaller thickness and thusfurther reduces costs.

While the invention has been described in detail with reference to thepreferred embodiments thereof, it will be apparent to one skilled in theart that various changes and modifications can be made and equivalentsemployed, without departing from the present invention.

1. (canceled)
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 5. (canceled) 6.(canceled)
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 15. (canceled)16. (canceled)
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 18. (canceled)
 19. The electrode of claim31, wherein the electrode segments each have a step configured tosurround a central electrode element such that the central electrodeelement is recessed inside the electrode segments.
 20. (canceled) 21.The electrode of claim 31, wherein the electrode segments are configuredto surround a central electrode element to create a total electrodediameter of at least 16 inches.
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 23. (canceled) 24.(canceled)
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 28. (canceled)29. (canceled)
 30. The electrode of claim 31, wherein the electrodesegments include a stepped lower surface.
 31. A replaceable electrodecomprising: a ring shaped backing plate; a plurality of electrodesegments forming a ring shaped electrode; an electrically conductiveelastomer securing the plurality of electrode segments to the ringshaped backing plate; and wherein the plurality of electrode segmentsform a ring having an inner diameter of about 12 inches and an inneredge with an angled surface.
 32. The electrode of claim 31, furthercomprising bores in the ring shaped backing plate for receiving aplurality of threaded screws to secure the electrode onto a top plate ina plasma reaction chamber.
 33. The electrode of claim 31, wherein theplurality of electrode segments are formed of a single crystal silicon,poly crystal silicon, or silicon carbide.
 34. The electrode of claim 31,wherein the backing plate is formed of graphite or silicon carbide. 35.(canceled)
 36. (canceled)